Why Kaynes Group?
We offer comprehensive capabilities across the entire spectrum of Electronics System Design and Manufacturing (ESDM) services. At Kaynes and its group companies, we go beyond traditional manufacturing by integrating design, prototyping, NPI, and product development to deliver seamless solutions. From rapid prototyping to high-volume production, our advanced infrastructure ensures unparalleled quality and customer satisfaction. Whether developing IT hardware, IoT devices, or critical systems for aerospace and defense, Kaynes is your trusted partner for impactful solutions. Together with Digicom, we offer seamless product servicing capabilities, ensuring comprehensive support for clients across India and the USA.
Capabilities
Procurement and materials management
Embedded Design, Firmware, Software, Mechanical Design, Engineering Services, Prototyping, and Regulatory/Certifications including Reliability.
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PCBA / Box
Build
Comprehensive Assembly Expertise: Advanced capabilities in PCBA with 20 SMT lines, 2.5 million components per hour placement capacity, and integrated processes for high-mix, low-to-high volume production, including selective soldering, conformal coating, and RoHS-compliant assembly.
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Tool Room, Molding, Sheet Metal
Advanced Tool Room Capabilities:Expertise in mold design, manufacture, and maintenance, including hot runner molds and molds with hydraulic/collapsible cores for complex and critical parts.
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Original Design Manufacturing (ODM)
Design-led electronics manufacturing to OEMs using mature embedded design capabilities.
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IoT
Solutions
"Canvas-to-cloud" industrial IoT solutions with in-house developed IPs and accelerators.
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Cable
Harness
Integrated manufacturing of wire harnesses and cable assemblies from design to servicing.
Automated Test Equipment & Functional Tester
Third-Party
Repairs
Bare
PCB
Comprehensive solutions for single-sided, multi-layered, and HDI PCBs with advanced inspection and RoHS-compliant manufacturing.
Semi-Conductor
Packaging
End-to-end packaging solutions including flip-chip, BGA, wafer-level packaging, and testing in cleanroom environments.
Wire
Bonding
Our wire bonding solutions support gold, silver, and copper wire bonding with advanced scrub processes and multiple inert gas purge options.
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Wire
Bonding
Our wire bonding solutions support gold, silver, and copper wire bonding with advanced scrub processes and multiple inert gas purge options.
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